Texas Instruments Incorporated XDLPC230TZDQQ1
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.31.00.01
  • SB Code
    8542.31.00.00
  • Width
    23 mm
  • Length
    23 mm
  • Bit Size
    24
  • Technology
    CMOS
  • JESD-30 Code
    S-PBGA-B324
  • Package Code
    BGA
  • Package Shape
    SQUARE
  • Package Style
    GRID ARRAY Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • Terminal Pitch
    1 mm
  • Screening Level
    AEC-Q100
  • Address Bus Width
    0
  • Bus Compatibility
    I2C, SPI
  • Seated Height-Max
    2.352 mm
  • Terminal Position
    BOTTOM
  • Supply Current-Max
    743.9 mA
  • Supply Voltage-Max
    1.155 V
  • Supply Voltage-Min
    1.045 V
  • Supply Voltage-Nom
    1.1 V
  • Clock Frequency-Max
    16.003 MHz
  • Number of Terminals
    324
  • Display Configuration
    1152 X 1152 PIXELS
  • Package Body Material
    PLASTIC/EPOXY
  • External Data Bus Width
    24
  • Package Equivalence Code
    BGA324,22X22,40
  • Operating Temperature-Max
    105 Cel
  • Operating Temperature-Min
    -40 Cel
  • uPs/uCs/Peripheral ICs Type
    DISPLAY CONTROLLER, DLP

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XDLPC230TZDQQ1