XCZU9CG-2FBVB900I

Xilinx,Inc.

Xilinx,Inc. XCZU9CG-2FBVB900I
  • HTS Code
    8542.31.00.01
  • SB Code
    8542.31.00.70
  • Technology
    CMOS
  • Width (mm)
    31
  • Length (mm)
    31
  • JESD-30 Code
    S-PBGA-B900
  • Package Code
    BGA
  • Package Shape
    SQUARE
  • Package Style
    GRID ARRAY Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • Bus Compatibility
    I2C(2), PCI, SATA, SGMII, SPI(2), UART(2), USB(2)
  • Temperature Grade
    INDUSTRIAL
  • Terminal Position
    BOTTOM
  • Number of Terminals
    900
  • Terminal Pitch (mm)
    1
  • Package Body Material
    PLASTIC/EPOXY
  • Seated Height-Max (mm)
    2.88
  • Supply Voltage-Max (V)
    0.876
  • Supply Voltage-Min (V)
    0.825
  • Supply Voltage-Nom (V)
    0.85
  • Package Equivalence Code
    BGA900,30X30,40
  • uPs/uCs/Peripheral ICs Type
    PROGRAMMABLE SoC
  • Operating Temperature-Max (Cel)
    100
  • Operating Temperature-Min (Cel)
    -40

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