ProductsManufacturers
Events
Send an RFQBOM Tool

XCZU7EV-1FFVF1517E

Xilinx,Inc.

Xilinx,Inc. XCZU7EV-1FFVF1517E
  • ECCN
    5A002.A.4
  • ECCN Governance
    EAR
  • HTS Code
    8542.39.00.01
  • SB Code
    8542.39.00.00
  • Technology
    CMOS
  • JESD-30 Code
    R-PBGA-B1517
  • Package Code
    BGA
  • Package Shape
    RECTANGULAR
  • Package Style
    GRID ARRAY Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • J-STD-609 Code
    e1
  • Terminal Finish
    Tin/Silver/Copper (Sn/Ag/Cu)
  • Temperature Grade
    OTHER
  • Terminal Position
    BOTTOM
  • Number of Terminals
    1517
  • Package Body Material
    PLASTIC/EPOXY
  • Supply Voltage-Max (V)
    0.876
  • Supply Voltage-Min (V)
    0.825
  • Supply Voltage-Nom (V)
    0.85
  • Moisture Sensitivity Level
    4
  • uPs/uCs/Peripheral ICs Type
    SoC
  • Operating Temperature-Max (Cel)
    100
  • Operating Temperature-Min (Cel)
    0

0 suppliers available to buy or to bid for XCZU7EV-1FFVF1517E

Send an RFQ

Your RFQ will be directly sent to our expert: Pari

Send an RFQ
XCZU7EV-1FFVF1517E
Send an RFQ
XCZU7EV-1FFVF1517E