ProductsManufacturers
Events
Send an RFQBOM Tool

XCZU7EG-3FBVB900I

Xilinx,Inc.

Xilinx,Inc. XCZU7EG-3FBVB900I
  • HTS Code
    8542.31.00.01
  • SB Code
    8542.31.00.70
  • Technology
    CMOS
  • Width (mm)
    31
  • Length (mm)
    31
  • JESD-30 Code
    S-PBGA-B900
  • Package Code
    BGA
  • Package Shape
    SQUARE
  • Package Style
    GRID ARRAY Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • J-STD-609 Code
    e1
  • Terminal Finish
    Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
  • Temperature Grade
    INDUSTRIAL
  • Terminal Position
    BOTTOM
  • Number of Terminals
    900
  • Terminal Pitch (mm)
    1
  • Package Body Material
    PLASTIC/EPOXY
  • Seated Height-Max (mm)
    2.97
  • Supply Voltage-Nom (V)
    0.9
  • Moisture Sensitivity Level
    4
  • uPs/uCs/Peripheral ICs Type
    PROGRAMMABLE SoC
  • Peak Reflow Temperature (Cel)
    245
  • Operating Temperature-Max (Cel)
    100
  • Operating Temperature-Min (Cel)
    -40
  • Time@Peak Reflow Temperature-Max (s)
    30

0 suppliers available to buy or to bid for XCZU7EG-3FBVB900I

Send an RFQ

Your RFQ will be directly sent to our expert: Pari

Send an RFQ
XCZU7EG-3FBVB900I
Send an RFQ
XCZU7EG-3FBVB900I