ProductsManufacturers
Events
Send an RFQBOM Tool

XCZU3TCG-L1SFVC784I

Advanced Micro Devices, Inc. (AMD)

Advanced Micro Devices, Inc. (AMD) XCZU3TCG-L1SFVC784I
  • HTS Code
    8542.31.00.01
  • SB Code
    8542.31.00.70
  • Technology
    CMOS
  • Width (mm)
    23
  • Length (mm)
    23
  • JESD-30 Code
    S-PBGA-B784
  • Package Code
    FBGA
  • Package Shape
    SQUARE
  • Package Style
    GRID ARRAY, FINE PITCH Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • Terminal Position
    BOTTOM
  • Number of Terminals
    784
  • Terminal Pitch (mm)
    0.8
  • Package Body Material
    PLASTIC/EPOXY
  • Seated Height-Max (mm)
    3.32
  • Supply Voltage-Max (V)
    0.892
  • Supply Voltage-Min (V)
    0.808
  • Supply Voltage-Nom (V)
    0.85
  • Package Equivalence Code
    BGA784,28X28,36
  • uPs/uCs/Peripheral ICs Type
    PROGRAMMABLE SoC
  • Operating Temperature-Max (Cel)
    100
  • Operating Temperature-Min (Cel)
    -40

0 suppliers available to buy or to bid for XCZU3TCG-L1SFVC784I

Send an RFQ

Your RFQ will be directly sent to our expert: Pari

Send an RFQ
XCZU3TCG-L1SFVC784I
Send an RFQ
XCZU3TCG-L1SFVC784I