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XCZU3EG-2LSFVA625E

Xilinx,Inc.

Xilinx,Inc. XCZU3EG-2LSFVA625E
  • HTS Code
    8542.31.00.01
  • SB Code
    8542.31.00.70
  • Technology
    CMOS
  • Width (mm)
    21
  • Length (mm)
    21
  • JESD-30 Code
    S-PBGA-B625
  • Package Code
    FBGA
  • Package Shape
    SQUARE
  • Package Style
    GRID ARRAY, FINE PITCH Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • J-STD-609 Code
    e1
  • Terminal Finish
    Tin/Silver/Copper (Sn/Ag/Cu)
  • Bus Compatibility
    CAN, I2C, SPI, UART
  • Temperature Grade
    OTHER
  • Terminal Position
    BOTTOM
  • Number of Terminals
    625
  • Terminal Pitch (mm)
    0.8
  • Package Body Material
    PLASTIC/EPOXY
  • Seated Height-Max (mm)
    3.43
  • Supply Voltage-Nom (V)
    0.85
  • External Data Bus Width
    0
  • Package Equivalence Code
    BGA625,25X25,32
  • Moisture Sensitivity Level
    4
  • uPs/uCs/Peripheral ICs Type
    PROGRAMMABLE SoC
  • Peak Reflow Temperature (Cel)
    250
  • Operating Temperature-Max (Cel)
    110
  • Operating Temperature-Min (Cel)
    0
  • Time@Peak Reflow Temperature-Max (s)
    30

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XCZU3EG-2LSFVA625E