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XCZU27DR-L2FFVG1517E

Advanced Micro Devices, Inc. (AMD)

Advanced Micro Devices, Inc. (AMD) XCZU27DR-L2FFVG1517E
  • HTS Code
    8542.31.00.60
  • SB Code
    8542.31.00.60
  • Width (mm)
    40
  • Length (mm)
    40
  • JESD-30 Code
    S-PBGA-B1517
  • Organization
    53160 CLBS
  • Package Code
    BGA
  • Package Shape
    SQUARE
  • Package Style
    GRID ARRAY Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • Number of CLBs
    53160
  • Terminal Finish
    Tin/Silver/Copper (Sn/Ag/Cu)
  • Number of Inputs
    561
  • Number of Outputs
    561
  • Terminal Position
    BOTTOM
  • Additional Feature
    ALSO OPERATES AT 0.85V NOMINAL SUPPLY
  • Number of Terminals
    1517
  • Terminal Pitch (mm)
    1
  • Number of Logic Cells
    930300
  • Package Body Material
    PLASTIC/EPOXY
  • Seated Height-Max (mm)
    3.86
  • Supply Voltage-Max (V)
    0.742
  • Supply Voltage-Min (V)
    0.698
  • Supply Voltage-Nom (V)
    0.72
  • Programmable Logic Type
    FPGA SOC
  • Package Equivalence Code
    BGA1517,39X39,40
  • Moisture Sensitivity Level
    4
  • Peak Reflow Temperature (Cel)
    245
  • Operating Temperature-Max (Cel)
    110
  • Operating Temperature-Min (Cel)
    0
  • Time@Peak Reflow Temperature-Max (s)
    30

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XCZU27DR-L2FFVG1517E