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XCZU27DR-2FFVE1156I

Advanced Micro Devices, Inc. (AMD)

XCZU27DR-2FFVE1156I Datasheet
Advanced Micro Devices, Inc. (AMD) XCZU27DR-2FFVE1156I
  • HTS Code
    8542.31.00.60
  • SB Code
    8542.31.00.60
  • Width (mm)
    35
  • Length (mm)
    35
  • JESD-30 Code
    S-PBGA-B1156
  • Organization
    53160 CLBS
  • Package Code
    BGA
  • Package Shape
    SQUARE
  • Package Style
    GRID ARRAY Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • Number of CLBs
    53160
  • Terminal Finish
    Tin/Silver/Copper (Sn/Ag/Cu)
  • Number of Inputs
    366
  • Number of Outputs
    366
  • Terminal Position
    BOTTOM
  • Number of Terminals
    1156
  • Terminal Pitch (mm)
    1
  • Number of Logic Cells
    930300
  • Package Body Material
    PLASTIC/EPOXY
  • Seated Height-Max (mm)
    3.86
  • Supply Voltage-Max (V)
    0.876
  • Supply Voltage-Min (V)
    0.825
  • Supply Voltage-Nom (V)
    0.85
  • Programmable Logic Type
    FPGA SOC
  • Package Equivalence Code
    BGA1156,34X34,40
  • Moisture Sensitivity Level
    4
  • Peak Reflow Temperature (Cel)
    245
  • Operating Temperature-Max (Cel)
    100
  • Operating Temperature-Min (Cel)
    -40
  • Time@Peak Reflow Temperature-Max (s)
    30

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XCZU27DR-2FFVE1156I