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XCZU19EG-2FFVD1760I

Xilinx,Inc.

Xilinx,Inc. XCZU19EG-2FFVD1760I
  • ECCN
    5A002.A.4
  • ECCN Governance
    EAR
  • HTS Code
    8542.39.00.01
  • SB Code
    8542.39.00.00
  • Technology
    CMOS
  • JESD-30 Code
    R-PBGA-B1760
  • Package Code
    BGA
  • Package Shape
    RECTANGULAR
  • Package Style
    GRID ARRAY Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • J-STD-609 Code
    e1
  • Terminal Finish
    Tin/Silver/Copper (Sn/Ag/Cu)
  • Temperature Grade
    INDUSTRIAL
  • Terminal Position
    BOTTOM
  • Number of Terminals
    1760
  • Package Body Material
    PLASTIC/EPOXY
  • Supply Voltage-Max (V)
    0.876
  • Supply Voltage-Min (V)
    0.825
  • Supply Voltage-Nom (V)
    0.85
  • Moisture Sensitivity Level
    4
  • uPs/uCs/Peripheral ICs Type
    SoC
  • Peak Reflow Temperature (Cel)
    245
  • Operating Temperature-Max (Cel)
    100
  • Operating Temperature-Min (Cel)
    -40
  • Time@Peak Reflow Temperature-Max (s)
    30

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XCZU19EG-2FFVD1760I