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XCZU19EG-1FFVE1924E

Advanced Micro Devices, Inc. (AMD)

Advanced Micro Devices, Inc. (AMD) XCZU19EG-1FFVE1924E
  • HTS Code
    8542.31.00.30
  • SB Code
    8542.31.00.30
  • Technology
    CMOS
  • JESD-30 Code
    R-PBGA-B1924
  • Package Code
    BGA
  • Package Shape
    RECTANGULAR
  • Package Style
    GRID ARRAY Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • J-STD-609 Code
    e1
  • Terminal Finish
    Tin/Silver/Copper (Sn/Ag/Cu)
  • Temperature Grade
    OTHER
  • Terminal Position
    BOTTOM
  • Number of Terminals
    1924
  • Package Body Material
    PLASTIC/EPOXY
  • Supply Voltage-Max (V)
    0.876
  • Supply Voltage-Min (V)
    0.825
  • Supply Voltage-Nom (V)
    0.85
  • Moisture Sensitivity Level
    4
  • uPs/uCs/Peripheral ICs Type
    SoC
  • Operating Temperature-Max (Cel)
    100
  • Operating Temperature-Min (Cel)
    0

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XCZU19EG-1FFVE1924E