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XCVP1202-3HSEVSVC2197

Advanced Micro Devices, Inc. (AMD)

Advanced Micro Devices, Inc. (AMD) XCVP1202-3HSEVSVC2197
  • HTS Code
    8542.31.00.30
  • SB Code
    8542.31.00.30
  • Technology
    CMOS
  • JESD-30 Code
    S-PBGA-B2197
  • Package Code
    BGA
  • Package Shape
    SQUARE
  • Package Style
    GRID ARRAY Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • Terminal Position
    BOTTOM
  • Number of Terminals
    2197
  • Package Body Material
    PLASTIC/EPOXY
  • Supply Voltage-Max (V)
    0.906
  • Supply Voltage-Min (V)
    0.854
  • Supply Voltage-Nom (V)
    0.88
  • uPs/uCs/Peripheral ICs Type
    SoC
  • Operating Temperature-Max (Cel)
    100
  • Operating Temperature-Min (Cel)
    0

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XCVP1202-3HSEVSVC2197
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XCVP1202-3HSEVSVC2197