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XCVP1002-1LSENFVI1369

Xilinx,Inc.

Xilinx,Inc. XCVP1002-1LSENFVI1369
  • HTS Code
    8542.31.00.01
  • SB Code
    8542.31.00.70
  • Technology
    CMOS
  • Width (mm)
    35
  • Length (mm)
    35
  • JESD-30 Code
    S-PBGA-B1369
  • Package Code
    BGA
  • Package Shape
    SQUARE
  • Package Style
    GRID ARRAY Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • Terminal Position
    BOTTOM
  • Number of Terminals
    1369
  • Terminal Pitch (mm)
    0.92
  • Package Body Material
    PLASTIC/EPOXY
  • Seated Height-Max (mm)
    3.83
  • Supply Voltage-Max (V)
    0.724
  • Supply Voltage-Min (V)
    0.676
  • Supply Voltage-Nom (V)
    0.7
  • Package Equivalence Code
    BGA1369,37X37,36
  • uPs/uCs/Peripheral ICs Type
    SoC
  • Operating Temperature-Max (Cel)
    100
  • Operating Temperature-Min (Cel)
    0

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XCVP1002-1LSENFVI1369