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XCVM1802-2MSEVFVC1760

Xilinx,Inc.

Xilinx,Inc. XCVM1802-2MSEVFVC1760
  • HTS Code
    8542.31.00.01
  • SB Code
    8542.31.00.70
  • Technology
    CMOS
  • Width (mm)
    40
  • Length (mm)
    40
  • JESD-30 Code
    S-PBGA-B1760
  • Package Code
    BGA
  • Package Shape
    SQUARE
  • Package Style
    GRID ARRAY Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • Terminal Position
    BOTTOM
  • Number of Terminals
    1760
  • Terminal Pitch (mm)
    0.92
  • Package Body Material
    PLASTIC/EPOXY
  • Seated Height-Max (mm)
    3.89
  • Supply Voltage-Max (V)
    0.825
  • Supply Voltage-Min (V)
    0.775
  • Supply Voltage-Nom (V)
    0.8
  • Package Equivalence Code
    BGA1760,42X42,36
  • uPs/uCs/Peripheral ICs Type
    SoC
  • Operating Temperature-Max (Cel)
    110
  • Operating Temperature-Min (Cel)
    0

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XCVM1802-2MSEVFVC1760