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XCVM1402-2HLEVSVD1760

Xilinx,Inc.

Xilinx,Inc. XCVM1402-2HLEVSVD1760
  • HTS Code
    8542.31.00.01
  • SB Code
    8542.31.00.70
  • Technology
    CMOS
  • Width (mm)
    40
  • Length (mm)
    40
  • JESD-30 Code
    S-PBGA-B1760
  • Package Code
    HBGA
  • Package Shape
    SQUARE
  • Package Style
    GRID ARRAY, HEAT SINK/SLUG Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • J-STD-609 Code
    e1
  • Terminal Finish
    Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
  • Terminal Position
    BOTTOM
  • Number of Terminals
    1760
  • Terminal Pitch (mm)
    0.92
  • Package Body Material
    PLASTIC/EPOXY
  • Seated Height-Max (mm)
    4
  • Supply Voltage-Max (V)
    0.906
  • Supply Voltage-Min (V)
    0.854
  • Supply Voltage-Nom (V)
    0.88
  • Package Equivalence Code
    BGA1760,42X42,36
  • uPs/uCs/Peripheral ICs Type
    SoC
  • Operating Temperature-Max (Cel)
    110
  • Operating Temperature-Min (Cel)
    0

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XCVM1402-2HLEVSVD1760