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XCVM1302-3MSEVFVA1760

Xilinx,Inc.

Xilinx,Inc. XCVM1302-3MSEVFVA1760
  • HTS Code
    8542.31.00.01
  • SB Code
    8542.31.00.70
  • Technology
    CMOS
  • JESD-30 Code
    R-PBGA-B1760
  • Package Code
    BGA
  • Package Shape
    RECTANGULAR
  • Package Style
    GRID ARRAY Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • Terminal Position
    BOTTOM
  • Number of Terminals
    1760
  • Package Body Material
    PLASTIC/EPOXY
  • Supply Voltage-Max (V)
    0.825
  • Supply Voltage-Min (V)
    0.775
  • Supply Voltage-Nom (V)
    0.8
  • uPs/uCs/Peripheral ICs Type
    SoC

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XCVM1302-3MSEVFVA1760
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XCVM1302-3MSEVFVA1760