ProductsManufacturers
Events
Send an RFQBOM Tool

XCVM1302-1HSIVFVA1760

Xilinx,Inc.

Xilinx,Inc. XCVM1302-1HSIVFVA1760
  • HTS Code
    8542.31.00.01
  • SB Code
    8542.31.00.70
  • Technology
    CMOS
  • JESD-30 Code
    R-PBGA-B1760
  • Package Code
    BGA
  • Package Shape
    RECTANGULAR
  • Package Style
    GRID ARRAY Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • Terminal Position
    BOTTOM
  • Number of Terminals
    1760
  • Package Body Material
    PLASTIC/EPOXY
  • Supply Voltage-Max (V)
    0.906
  • Supply Voltage-Min (V)
    0.854
  • Supply Voltage-Nom (V)
    0.88
  • uPs/uCs/Peripheral ICs Type
    SoC
  • Operating Temperature-Max (Cel)
    110
  • Operating Temperature-Min (Cel)
    -40

0 suppliers available to buy or to bid for XCVM1302-1HSIVFVA1760

Send an RFQ

Your RFQ will be directly sent to our expert: Pari

Send an RFQ
XCVM1302-1HSIVFVA1760
Send an RFQ
XCVM1302-1HSIVFVA1760