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XCVM1102-2MSISFVA784

Advanced Micro Devices, Inc. (AMD)

Advanced Micro Devices, Inc. (AMD) XCVM1102-2MSISFVA784
  • HTS Code
    8542.31.00.30
  • SB Code
    8542.31.00.30
  • Technology
    CMOS
  • JESD-30 Code
    S-PBGA-B784
  • Package Code
    BGA
  • Package Shape
    SQUARE
  • Package Style
    GRID ARRAY Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • J-STD-609 Code
    e1
  • Terminal Finish
    Tin/Silver/Copper (Sn/Ag/Cu)
  • Terminal Position
    BOTTOM
  • Number of Terminals
    784
  • Package Body Material
    PLASTIC/EPOXY
  • Supply Voltage-Max (V)
    0.825
  • Supply Voltage-Min (V)
    0.775
  • Supply Voltage-Nom (V)
    0.8
  • uPs/uCs/Peripheral ICs Type
    SoC
  • Operating Temperature-Max (Cel)
    110
  • Operating Temperature-Min (Cel)
    -40

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XCVM1102-2MSISFVA784
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XCVM1102-2MSISFVA784