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XCV200E-7CSG144I

Xilinx,Inc.

Xilinx,Inc. XCV200E-7CSG144I
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.39.00.01
  • SB Code
    8542.39.00.00
  • Technology
    CMOS
  • Width (mm)
    12
  • Length (mm)
    12
  • JESD-30 Code
    S-PBGA-B144
  • Organization
    1176 CLBS, 63504 GATES
  • Package Code
    TFBGA
  • Package Shape
    SQUARE
  • Package Style
    GRID ARRAY, THIN PROFILE, FINE PITCH Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • J-STD-609 Code
    e1
  • Number of CLBs
    1176
  • Terminal Finish
    TIN SILVER COPPER
  • Number of Inputs
    94
  • DLA Qualification
    Not Qualified
  • Number of Outputs
    94
  • Terminal Position
    BOTTOM
  • Number of Terminals
    144
  • Terminal Pitch (mm)
    0.8
  • Number of Logic Cells
    5292
  • Package Body Material
    PLASTIC/EPOXY
  • Seated Height-Max (mm)
    1.2
  • Supply Voltage-Max (V)
    1.89
  • Supply Voltage-Min (V)
    1.71
  • Supply Voltage-Nom (V)
    1.8
  • Programmable Logic Type
    FIELD PROGRAMMABLE GATE ARRAY
  • Package Equivalence Code
    BGA144,13X13,32
  • Clock Frequency-Max (MHz)
    400
  • Moisture Sensitivity Level
    3
  • Number of Equivalent Gates
    63504
  • Peak Reflow Temperature (Cel)
    260
  • Operating Temperature-Max (Cel)
    100
  • Operating Temperature-Min (Cel)
    -40
  • Time@Peak Reflow Temperature-Max (s)
    30
  • Combinatorial Delay of a CLB-Max (ns)
    0.42

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XCV200E-7CSG144I
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XCV200E-7CSG144I