ProductsManufacturers
Events
Send an RFQBOM Tool

XCV200-6BGG256I

Xilinx,Inc.

Xilinx,Inc. XCV200-6BGG256I
  • HTS Code
    8542.39.00.01
  • SB Code
    8542.31.00.60
  • Technology
    CMOS
  • Width (mm)
    27
  • Length (mm)
    27
  • JESD-30 Code
    S-PBGA-B256
  • Organization
    1176 CLBS, 236666 GATES
  • Package Code
    BGA
  • Package Shape
    SQUARE
  • Package Style
    GRID ARRAY Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • J-STD-609 Code
    e1
  • Number of CLBs
    1176
  • Terminal Finish
    Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)
  • Number of Inputs
    180
  • DLA Qualification
    Not Qualified
  • Number of Outputs
    180
  • Terminal Position
    BOTTOM
  • Number of Terminals
    256
  • Terminal Pitch (mm)
    1.27
  • Package Body Material
    PLASTIC/EPOXY
  • Seated Height-Max (mm)
    2.55
  • Supply Voltage-Max (V)
    2.625
  • Supply Voltage-Min (V)
    2.375
  • Supply Voltage-Nom (V)
    2.5
  • Programmable Logic Type
    FIELD PROGRAMMABLE GATE ARRAY
  • Package Equivalence Code
    BGA256,20X20,50
  • Clock Frequency-Max (MHz)
    333
  • Moisture Sensitivity Level
    3
  • Number of Equivalent Gates
    236666
  • Peak Reflow Temperature (Cel)
    250
  • Operating Temperature-Max (Cel)
    100
  • Operating Temperature-Min (Cel)
    -40
  • Time@Peak Reflow Temperature-Max (s)
    30
  • Combinatorial Delay of a CLB-Max (ns)
    0.6

0 suppliers available to buy or to bid for XCV200-6BGG256I

Send an RFQ

Your RFQ will be directly sent to our expert: Pari

Send an RFQ
XCV200-6BGG256I
Send an RFQ
XCV200-6BGG256I