ProductsManufacturers
Events
Send an RFQBOM Tool

XCV150-4FG256I

Xilinx,Inc.

Xilinx,Inc. XCV150-4FG256I
  • HTS Code
    8542.39.00.01
  • SB Code
    8542.31.00.60
  • Technology
    CMOS
  • Width (mm)
    17
  • Length (mm)
    17
  • JESD-30 Code
    S-PBGA-B256
  • Organization
    864 CLBS, 164674 GATES
  • Package Code
    BGA
  • Package Shape
    SQUARE
  • Package Style
    GRID ARRAY Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • J-STD-609 Code
    e0
  • Number of CLBs
    864
  • Terminal Finish
    Tin/Lead (Sn63Pb37)
  • Number of Inputs
    176
  • DLA Qualification
    Not Qualified
  • Number of Outputs
    176
  • Terminal Position
    BOTTOM
  • Number of Terminals
    256
  • Terminal Pitch (mm)
    1
  • Number of Logic Cells
    3888
  • Package Body Material
    PLASTIC/EPOXY
  • Seated Height-Max (mm)
    2
  • Supply Voltage-Max (V)
    2.625
  • Supply Voltage-Min (V)
    2.375
  • Supply Voltage-Nom (V)
    2.5
  • Programmable Logic Type
    FIELD PROGRAMMABLE GATE ARRAY
  • Package Equivalence Code
    BGA256,16X16,40
  • Clock Frequency-Max (MHz)
    250
  • Moisture Sensitivity Level
    3
  • Number of Equivalent Gates
    164674
  • Peak Reflow Temperature (Cel)
    225
  • Operating Temperature-Max (Cel)
    100
  • Operating Temperature-Min (Cel)
    -40
  • Time@Peak Reflow Temperature-Max (s)
    30
  • Combinatorial Delay of a CLB-Max (ns)
    0.8

0 suppliers available to buy or to bid for XCV150-4FG256I

Send an RFQ

Your RFQ will be directly sent to our expert: Pari

Send an RFQ
XCV150-4FG256I
Send an RFQ
XCV150-4FG256I