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XCV1000-6BGG560C

Xilinx,Inc.

Xilinx,Inc. XCV1000-6BGG560C
  • HTS Code
    8542.39.00.01
  • SB Code
    8542.31.00.60
  • Technology
    CMOS
  • Width (mm)
    42.5
  • Length (mm)
    42.5
  • JESD-30 Code
    S-PBGA-B560
  • Organization
    6144 CLBS, 1124022 GATES
  • Package Code
    LBGA
  • Package Shape
    SQUARE
  • Package Style
    GRID ARRAY, LOW PROFILE Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • J-STD-609 Code
    e1
  • Number of CLBs
    6144
  • Terminal Finish
    Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)
  • DLA Qualification
    Not Qualified
  • Temperature Grade
    OTHER
  • Terminal Position
    BOTTOM
  • Number of Terminals
    560
  • Terminal Pitch (mm)
    1.27
  • Package Body Material
    PLASTIC/EPOXY
  • Seated Height-Max (mm)
    1.7
  • Supply Voltage-Max (V)
    2.625
  • Supply Voltage-Min (V)
    2.375
  • Supply Voltage-Nom (V)
    2.5
  • Programmable Logic Type
    FIELD PROGRAMMABLE GATE ARRAY
  • Clock Frequency-Max (MHz)
    333
  • Moisture Sensitivity Level
    3
  • Number of Equivalent Gates
    1124022
  • Peak Reflow Temperature (Cel)
    260
  • Operating Temperature-Max (Cel)
    85
  • Operating Temperature-Min (Cel)
    0
  • Time@Peak Reflow Temperature-Max (s)
    30
  • Combinatorial Delay of a CLB-Max (ns)
    0.6

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XCV1000-6BGG560C
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XCV1000-6BGG560C