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XCR3384XL-7.5CSG280I

Xilinx,Inc.

Xilinx,Inc. XCR3384XL-7.5CSG280I
  • ECCN
    3A991.d
  • ECCN Governance
    EAR
  • HTS Code
    8542.31.00.55
  • SB Code
    8542.31.00.55
  • Technology
    CMOS
  • Width (mm)
    16
  • Length (mm)
    16
  • JESD-30 Code
    S-PBGA-B280
  • Organization
    216 I/O
  • Package Code
    TFBGA
  • Package Shape
    SQUARE
  • Package Style
    GRID ARRAY, THIN PROFILE, FINE PITCH Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • J-STD-609 Code
    e1
  • Output Function
    MACROCELL
  • Terminal Finish
    TIN SILVER COPPER
  • DLA Qualification
    Not Qualified
  • Temperature Grade
    INDUSTRIAL
  • Terminal Position
    BOTTOM
  • Number of I/O Lines
    216
  • Number of Terminals
    280
  • Terminal Pitch (mm)
    0.8
  • Package Body Material
    PLASTIC/EPOXY
  • Propagation Delay (ns)
    7.5
  • Seated Height-Max (mm)
    1.2
  • Supply Voltage-Max (V)
    3.6
  • Supply Voltage-Min (V)
    2.7
  • Supply Voltage-Nom (V)
    3.3
  • Programmable Logic Type
    EE PLD
  • Package Equivalence Code
    BGA280,19X19,32
  • Moisture Sensitivity Level
    3
  • Operating Temperature-Max (Cel)
    85
  • Operating Temperature-Min (Cel)
    -40

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XCR3384XL-7.5CSG280I