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XCR3384XL-12FGG324I

Xilinx,Inc.

Xilinx,Inc. XCR3384XL-12FGG324I
  • ECCN
    3A991.d
  • ECCN Governance
    EAR
  • HTS Code
    8542.31.00.55
  • SB Code
    8542.31.00.55
  • JTAG BST
    YES
  • Technology
    CMOS
  • Width (mm)
    23
  • Length (mm)
    23
  • JESD-30 Code
    S-PBGA-B324
  • Organization
    0 DEDICATED INPUTS, 220 I/O
  • Package Code
    BGA
  • Package Shape
    SQUARE
  • Package Style
    GRID ARRAY Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • J-STD-609 Code
    e1
  • Output Function
    MACROCELL
  • Terminal Finish
    TIN SILVER COPPER
  • DLA Qualification
    Not Qualified
  • Temperature Grade
    INDUSTRIAL
  • Terminal Position
    BOTTOM
  • Additional Feature
    YES
  • Number of I/O Lines
    220
  • Number of Terminals
    324
  • Terminal Pitch (mm)
    1
  • Number of Macro Cells
    384
  • Package Body Material
    PLASTIC/EPOXY
  • In-System Programmable
    YES
  • Propagation Delay (ns)
    12
  • Seated Height-Max (mm)
    2.5
  • Supply Voltage-Max (V)
    3.6
  • Supply Voltage-Min (V)
    2.7
  • Supply Voltage-Nom (V)
    3.3
  • Programmable Logic Type
    EE PLD
  • Package Equivalence Code
    BGA324,20X20,40
  • Clock Frequency-Max (MHz)
    83
  • Moisture Sensitivity Level
    3
  • Number of Dedicated Inputs
    0
  • Peak Reflow Temperature (Cel)
    250
  • Operating Temperature-Max (Cel)
    85
  • Operating Temperature-Min (Cel)
    -40
  • Time@Peak Reflow Temperature-Max (s)
    30

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XCR3384XL-12FGG324I