ProductsManufacturers
Events
Send an RFQBOM Tool

XC8101M1375C

Motorola,Inc.

Motorola,Inc. XC8101M1375C
  • ECCN
    3A991.a.2
  • ECCN Governance
    EAR
  • HTS Code
    8542.31.00.35
  • SB Code
    8542.31.00.35
  • Format
    FIXED POINT
  • Bit Size
    16
  • Technology
    CMOS
  • Width (mm)
    17
  • Length (mm)
    17
  • RAM (words)
    524288
  • JESD-30 Code
    S-PBGA-B332
  • Package Code
    FBGA
  • Boundary Scan
    YES
  • Package Shape
    SQUARE
  • Package Style
    GRID ARRAY, FINE PITCH Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • Barrel Shifter
    NO
  • Low Power Mode
    YES
  • Address Bus Width
    32
  • DLA Qualification
    Not Qualified
  • Temperature Grade
    COMMERCIAL
  • Terminal Position
    BOTTOM
  • Number of Terminals
    332
  • Terminal Pitch (mm)
    0.8
  • Package Body Material
    PLASTIC/EPOXY
  • Seated Height-Max (mm)
    3.18
  • Supply Voltage-Max (V)
    1.7
  • Supply Voltage-Min (V)
    1.5
  • Supply Voltage-Nom (V)
    1.6
  • External Data Bus Width
    64
  • Package Equivalence Code
    BGA332,19X19,32
  • Clock Frequency-Max (MHz)
    68.75
  • Internal Bus Architecture
    MULTIPLE
  • uPs/uCs/Peripheral ICs Type
    DIGITAL SIGNAL PROCESSOR, OTHER
  • Operating Temperature-Max (Cel)
    70
  • Operating Temperature-Min (Cel)
    0

0 suppliers available to buy or to bid for XC8101M1375C

Send an RFQ

Your RFQ will be directly sent to our expert: Pari

Send an RFQ
XC8101M1375C
Send an RFQ
XC8101M1375C