XC7Z007S-1CLG225C by Xilinx,Inc. | Sourcengine

Xilinx,Inc. XC7Z007S-1CLG225C

Lifecycle status
Transferred
RoHS
RoHS compliant
REACH
REACH compliant
Description
AMD XILINX - XC7Z007S-1CLG225C - PSoC / MPSoC Microprocessor, Zynq-7000 Family, ARM Cortex-A9, 667 MHz, BGA-225
Category
Semiconductors UPs/uCs/Peripheral ICs Other uPs/uCs/Peripheral ICs SoC

ECCN
EAR99
ECCN Governance
EAR
HTS Code
8542.39.00.01
SB Code
8542.39.00.00

Technology
CMOS
Width (mm)
13
Length (mm)
13
JESD-30 Code
S-PBGA-B225
Package Code
LFBGA
Package Shape
SQUARE
Package Style
GRID ARRAY, LOW PROFILE, FINE PITCH Meter
Surface Mount
YES
Terminal Form
BALL
Terminal Finish
Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Position
BOTTOM
Number of Terminals
225
Terminal Pitch (mm)
0.8
Package Body Material
PLASTIC/EPOXY
Seated Height-Max (mm)
1.5
Supply Voltage-Max (V)
1.05
Supply Voltage-Min (V)
0.95
Supply Voltage-Nom (V)
1
Package Equivalence Code
BGA225,15X15,32
Moisture Sensitivity Level
3
uPs/uCs/Peripheral ICs Type
SoC
Peak Reflow Temperature (Cel)
260
Operating Temperature-Max (Cel)
85
Operating Temperature-Min (Cel)
0
Time@Peak Reflow Temperature-Max (s)
30