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XC7K325T-2FBG900C

Xilinx,Inc.

Xilinx,Inc. XC7K325T-2FBG900C
  • ECCN
    3A991.D
  • ECCN Governance
    EAR
  • HTS Code
    8542.39.00.01
  • SB Code
    8542.39.00.00
  • Technology
    CMOS, 28 nm
  • Width (mm)
    31
  • Length (mm)
    31
  • JESD-30 Code
    S-PBGA-B900
  • Organization
    25475 CLBS
  • Package Code
    BGA
  • Package Shape
    SQUARE
  • Package Style
    GRID ARRAY Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • J-STD-609 Code
    e1
  • Number of CLBs
    25475
  • Terminal Finish
    Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
  • Number of Inputs
    500
  • DLA Qualification
    Not Qualified
  • Number of Outputs
    500
  • Temperature Grade
    OTHER
  • Terminal Position
    BOTTOM
  • Number of Terminals
    900
  • Terminal Pitch (mm)
    1
  • Number of Logic Cells
    326080
  • Package Body Material
    PLASTIC/EPOXY
  • Seated Height-Max (mm)
    2.54
  • Supply Voltage-Max (V)
    1.03
  • Supply Voltage-Min (V)
    0.97
  • Supply Voltage-Nom (V)
    1
  • Programmable Logic Type
    FIELD PROGRAMMABLE GATE ARRAY
  • Package Equivalence Code
    BGA900,30X30,40
  • Clock Frequency-Max (MHz)
    1818
  • Moisture Sensitivity Level
    4
  • Peak Reflow Temperature (Cel)
    245
  • Operating Temperature-Max (Cel)
    85
  • Operating Temperature-Min (Cel)
    0
  • Time@Peak Reflow Temperature-Max (s)
    30
  • Combinatorial Delay of a CLB-Max (ns)
    0.61

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XC7K325T-2FBG900C