XC3S2000-4FG900C by Advanced Micro Devices, Inc. (AMD) | Sourcengine

Advanced Micro Devices, Inc. (AMD) XC3S2000-4FG900C

Lifecycle status
Discontinued
Description
Field Programmable Gate Array, 5120 CLBs, 2000000 Gates, 630MHz, 46080-Cell, CMOS, PBGA900
Category
Semiconductors Programmable Logic ICs Field Programmable Gate Arrays FIELD PROGRAMMABLE GATE ARRAY

HTS Code
8542.39.00.01
SB Code
8542.31.00.60

Technology
CMOS
Width (mm)
31
Length (mm)
31
JESD-30 Code
S-PBGA-B900
Organization
5120 CLBS, 2000000 GATES
Package Code
BGA
Package Shape
SQUARE
Package Style
GRID ARRAY Meter
Surface Mount
YES
Terminal Form
BALL
J-STD-609 Code
e0
Number of CLBs
5120
Terminal Finish
TIN LEAD
Number of Inputs
565
DLA Qualification
Not Qualified
Number of Outputs
565
Temperature Grade
OTHER
Terminal Position
BOTTOM
Number of Terminals
900
Terminal Pitch (mm)
1
Number of Logic Cells
46080
Package Body Material
PLASTIC/EPOXY
Seated Height-Max (mm)
2.6
Supply Voltage-Max (V)
1.26
Supply Voltage-Min (V)
1.14
Supply Voltage-Nom (V)
1.2
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
Package Equivalence Code
BGA900,30X30,40
Clock Frequency-Max (MHz)
630
Moisture Sensitivity Level
3
Number of Equivalent Gates
2000000
Peak Reflow Temperature (Cel)
225
Operating Temperature-Max (Cel)
85
Operating Temperature-Min (Cel)
0
Time@Peak Reflow Temperature-Max (s)
30
Combinatorial Delay of a CLB-Max (ns)
0.61