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XC3S1400AN-4FGG484C

Xilinx,Inc.

Xilinx,Inc. XC3S1400AN-4FGG484C
  • ECCN
    3A991.D
  • ECCN Governance
    EAR
  • HTS Code
    8542.39.00.01
  • SB Code
    8542.31.00.60
  • Technology
    CMOS
  • Width (mm)
    23
  • Length (mm)
    23
  • JESD-30 Code
    S-PBGA-B484
  • Organization
    2816 CLBS, 1400000 GATES
  • Package Code
    BGA
  • Package Shape
    SQUARE
  • Package Style
    GRID ARRAY Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • Number of CLBs
    2816
  • Number of Inputs
    375
  • DLA Qualification
    Not Qualified
  • Number of Outputs
    288
  • Temperature Grade
    OTHER
  • Terminal Position
    BOTTOM
  • Number of Terminals
    484
  • Terminal Pitch (mm)
    1
  • Number of Logic Cells
    25344
  • Package Body Material
    PLASTIC/EPOXY
  • Seated Height-Max (mm)
    2.6
  • Supply Voltage-Max (V)
    1.26
  • Supply Voltage-Min (V)
    1.14
  • Supply Voltage-Nom (V)
    1.2
  • Programmable Logic Type
    FIELD PROGRAMMABLE GATE ARRAY
  • Package Equivalence Code
    BGA484,22X22,40
  • Clock Frequency-Max (MHz)
    667
  • Number of Equivalent Gates
    1400000
  • Peak Reflow Temperature (Cel)
    NOT SPECIFIED
  • Operating Temperature-Max (Cel)
    85
  • Operating Temperature-Min (Cel)
    0
  • Time@Peak Reflow Temperature-Max (s)
    NOT SPECIFIED
  • Combinatorial Delay of a CLB-Max (ns)
    0.71

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XC3S1400AN-4FGG484C