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XC3130-3TQ100C

Xilinx,Inc.

Xilinx,Inc. XC3130-3TQ100C
  • HTS Code
    8542.39.00.01
  • SB Code
    8542.31.00.60
  • Technology
    CMOS
  • Width (mm)
    14
  • Length (mm)
    14
  • JESD-30 Code
    S-PQFP-G100
  • Organization
    100 CLBS, 2000 GATES
  • Package Code
    FQFP
  • Package Shape
    SQUARE
  • Package Style
    FLATPACK, FINE PITCH Meter
  • Surface Mount
    YES
  • Terminal Form
    GULL WING
  • J-STD-609 Code
    e0
  • Number of CLBs
    100
  • Terminal Finish
    TIN LEAD
  • Number of Inputs
    80
  • DLA Qualification
    Not Qualified
  • Number of Outputs
    80
  • Temperature Grade
    COMMERCIAL
  • Terminal Position
    QUAD
  • Additional Feature
    MAX. 80 I/OS; 360 FLIP-FLOPS; TYP. GATES = 2000 - 2700
  • Number of Terminals
    100
  • Terminal Pitch (mm)
    0.5
  • Number of Logic Cells
    100
  • Package Body Material
    PLASTIC/EPOXY
  • Seated Height-Max (mm)
    1.75
  • Supply Voltage-Max (V)
    5.25
  • Supply Voltage-Min (V)
    4.75
  • Supply Voltage-Nom (V)
    5
  • Programmable Logic Type
    FIELD PROGRAMMABLE GATE ARRAY
  • Package Equivalence Code
    QFP100,.63SQ,20
  • Clock Frequency-Max (MHz)
    270
  • Moisture Sensitivity Level
    3
  • Number of Equivalent Gates
    2000
  • Peak Reflow Temperature (Cel)
    225
  • Operating Temperature-Max (Cel)
    70
  • Operating Temperature-Min (Cel)
    0
  • Time@Peak Reflow Temperature-Max (s)
    30
  • Combinatorial Delay of a CLB-Max (ns)
    2.7

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XC3130-3TQ100C