ProductsManufacturers
Events
Send an RFQBOM Tool

XC3090-70CQ164MSPC0107

Xilinx,Inc.

Xilinx,Inc. XC3090-70CQ164MSPC0107
  • ECCN
    3A001.a.2.c
  • ECCN Governance
    EAR
  • HTS Code
    8542.31.00.60
  • SB Code
    8542.31.00.60
  • Technology
    CMOS
  • Width (mm)
    27.432
  • Length (mm)
    27.432
  • JESD-30 Code
    S-CQFP-F164
  • Organization
    320 CLBS, 9000 GATES
  • Package Code
    QFF
  • Package Shape
    SQUARE
  • Package Style
    FLATPACK Meter
  • Surface Mount
    YES
  • Terminal Form
    FLAT
  • Number of CLBs
    320
  • Number of Inputs
    142
  • DLA Qualification
    Not Qualified
  • Number of Outputs
    142
  • Temperature Grade
    MILITARY
  • Terminal Position
    QUAD
  • Additional Feature
    MAX 142 I/OS; 928 FLIP-FLOPS; POWER-DOWN SUPPLY CURRENT = 5UA @ VCC = 3.2V & T = 25DEG CEL
  • Number of Terminals
    164
  • Terminal Pitch (mm)
    0.635
  • Package Body Material
    CERAMIC, METAL-SEALED COFIRED
  • Seated Height-Max (mm)
    3.683
  • Supply Voltage-Max (V)
    5.5
  • Supply Voltage-Min (V)
    4.5
  • Supply Voltage-Nom (V)
    5
  • Programmable Logic Type
    FIELD PROGRAMMABLE GATE ARRAY
  • Package Equivalence Code
    QFL164,1.2SQ,25
  • Clock Frequency-Max (MHz)
    70
  • Number of Equivalent Gates
    9000
  • Operating Temperature-Max (Cel)
    125
  • Operating Temperature-Min (Cel)
    -55
  • Combinatorial Delay of a CLB-Max (ns)
    9

0 suppliers available to buy or to bid for XC3090-70CQ164MSPC0107

Send an RFQ

Your RFQ will be directly sent to our expert: Pari

Send an RFQ
XC3090-70CQ164MSPC0107
Send an RFQ
XC3090-70CQ164MSPC0107