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XC3090-100PG175CSPC0109

Xilinx,Inc.

Xilinx,Inc. XC3090-100PG175CSPC0109
  • HTS Code
    8542.39.00.01
  • SB Code
    8542.31.00.60
  • Technology
    CMOS
  • Width (mm)
    42.164
  • Length (mm)
    42.164
  • JESD-30 Code
    S-CPGA-P175
  • Organization
    320 CLBS, 9000 GATES
  • Package Code
    PGA
  • Package Shape
    SQUARE
  • Package Style
    GRID ARRAY Meter
  • Surface Mount
    NO
  • Terminal Form
    PIN/PEG
  • Number of CLBs
    320
  • Number of Inputs
    144
  • DLA Qualification
    Not Qualified
  • Number of Outputs
    144
  • Temperature Grade
    COMMERCIAL
  • Terminal Position
    PERPENDICULAR
  • Additional Feature
    MAX 144 I/OS; 928 FLIP-FLOPS; POWER-DOWN SUPPLY CURRENT = 5UA @ VCC = 3.2V & T = 25DEG CEL
  • Number of Terminals
    175
  • Terminal Pitch (mm)
    2.54
  • Package Body Material
    CERAMIC, METAL-SEALED COFIRED
  • Seated Height-Max (mm)
    3.5052
  • Supply Voltage-Max (V)
    5.25
  • Supply Voltage-Min (V)
    4.75
  • Supply Voltage-Nom (V)
    5
  • Programmable Logic Type
    FIELD PROGRAMMABLE GATE ARRAY
  • Package Equivalence Code
    PGA176,16X16MOD
  • Clock Frequency-Max (MHz)
    100
  • Number of Equivalent Gates
    9000
  • Operating Temperature-Max (Cel)
    70
  • Operating Temperature-Min (Cel)
    0
  • Combinatorial Delay of a CLB-Max (ns)
    7

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XC3090-100PG175CSPC0109