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XC2VP70-6FFG1517I

Xilinx,Inc.

Xilinx,Inc. XC2VP70-6FFG1517I
  • ECCN
    3A001.A.7.A
  • ECCN Governance
    EAR
  • HTS Code
    8542.39.00.01
  • SB Code
    8542.39.00.00
  • Technology
    CMOS
  • Width (mm)
    40
  • Length (mm)
    40
  • JESD-30 Code
    S-PBGA-B1517
  • Organization
    8272 CLBS
  • Package Code
    BGA
  • Package Shape
    SQUARE
  • Package Style
    GRID ARRAY Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • J-STD-609 Code
    e1
  • Number of CLBs
    8272
  • Terminal Finish
    Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)
  • Number of Inputs
    964
  • DLA Qualification
    Not Qualified
  • Number of Outputs
    964
  • Terminal Position
    BOTTOM
  • Number of Terminals
    1517
  • Terminal Pitch (mm)
    1
  • Number of Logic Cells
    74448
  • Package Body Material
    PLASTIC/EPOXY
  • Seated Height-Max (mm)
    3.4
  • Supply Voltage-Max (V)
    1.575
  • Supply Voltage-Min (V)
    1.425
  • Supply Voltage-Nom (V)
    1.5
  • Programmable Logic Type
    FIELD PROGRAMMABLE GATE ARRAY
  • Package Equivalence Code
    BGA1517,39X39,40
  • Clock Frequency-Max (MHz)
    1200
  • Moisture Sensitivity Level
    4
  • Peak Reflow Temperature (Cel)
    245
  • Operating Temperature-Max (Cel)
    100
  • Operating Temperature-Min (Cel)
    -40
  • Time@Peak Reflow Temperature-Max (s)
    30
  • Combinatorial Delay of a CLB-Max (ns)
    0.32

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XC2VP70-6FFG1517I