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XC1764-CD8C

Xilinx,Inc.

Xilinx,Inc. XC1764-CD8C
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.71
  • SB Code
    8542.32.00.70
  • I/O Type
    COMMON
  • Technology
    CMOS
  • JESD-30 Code
    R-XDIP-T8
  • Memory Width
    1
  • Organization
    64KX1
  • Package Code
    DIP
  • Package Shape
    RECTANGULAR
  • Package Style
    IN-LINE Meter
  • Surface Mount
    NO
  • Terminal Form
    THROUGH-HOLE
  • Memory Density
    65536 bit
  • Memory IC Type
    CONFIGURATION MEMORY
  • Terminal Pitch
    2.54 mm
  • Number of Words
    65536 words
  • Temperature Grade
    INDUSTRIAL
  • Terminal Position
    DUAL
  • Supply Current-Max
    10 mA
  • Number of Terminals
    8
  • Standby Current-Max
    0.0005 Amp
  • Number of Words Code
    64K
  • Qualification Status
    Not Qualified
  • Package Body Material
    CERAMIC
  • Output Characteristics
    3-STATE
  • Package Equivalence Code
    DIP8,.3
  • Operating Temperature-Max
    85 Cel
  • Operating Temperature-Min
    -40 Cel
  • Supply Voltage-Nom (Vsup)
    5 V
  • Clock Frequency-Max (fCLK)
    2.5 MHz

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XC1764-CD8C