ProductsManufacturers
Events
Send an RFQBOM Tool

XC1718D-DD8M

Xilinx,Inc.

Xilinx,Inc. XC1718D-DD8M
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.71
  • SB Code
    8542.32.00.70
  • I/O Type
    COMMON
  • Technology
    CMOS
  • JESD-30 Code
    R-XDIP-T8
  • Memory Width
    1
  • Package Code
    DIP
  • Package Shape
    RECTANGULAR
  • Package Style
    IN-LINE Meter
  • Surface Mount
    NO
  • Terminal Form
    THROUGH-HOLE
  • Memory IC Type
    CONFIGURATION MEMORY
  • DLA Qualification
    Not Qualified
  • Temperature Grade
    MILITARY
  • Terminal Position
    DUAL
  • Memory Organization
    18144X1
  • Number of Terminals
    8
  • Terminal Pitch (mm)
    2.54
  • Number of Words Code
    18144
  • Package Body Material
    CERAMIC
  • Output Characteristics
    3-STATE
  • Supply Voltage-Nom (V)
    5
  • Number of Words (words)
    18144
  • Standby Current-Max (A)
    0.0015
  • Supply Current-Max (mA)
    10
  • Package Equivalence Code
    DIP8,.3
  • Clock Frequency-Max (MHz)
    5
  • Operating Temperature-Max (Cel)
    125
  • Operating Temperature-Min (Cel)
    -55

0 suppliers available to buy or to bid for XC1718D-DD8M

Send an RFQ

Your RFQ will be directly sent to our expert: Pari

Send an RFQ
XC1718D-DD8M
Send an RFQ
XC1718D-DD8M