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XC1718D-DD8I

Xilinx,Inc.

XC1718D-DD8I Datasheet
Xilinx,Inc. XC1718D-DD8I
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.71
  • SB Code
    8542.32.00.70
  • I/O Type
    COMMON
  • Technology
    CMOS
  • JESD-30 Code
    R-XDIP-T8
  • Memory Width
    1
  • Package Code
    DIP
  • Package Shape
    RECTANGULAR
  • Package Style
    IN-LINE Meter
  • Surface Mount
    NO
  • Terminal Form
    THROUGH-HOLE
  • Memory IC Type
    CONFIGURATION MEMORY
  • DLA Qualification
    Not Qualified
  • Temperature Grade
    INDUSTRIAL
  • Terminal Position
    DUAL
  • Memory Organization
    18144X1
  • Number of Terminals
    8
  • Terminal Pitch (mm)
    2.54
  • Number of Words Code
    18144
  • Package Body Material
    CERAMIC
  • Output Characteristics
    3-STATE
  • Supply Voltage-Nom (V)
    5
  • Number of Words (words)
    18144
  • Standby Current-Max (A)
    0.0015
  • Supply Current-Max (mA)
    10
  • Package Equivalence Code
    DIP8,.3
  • Clock Frequency-Max (MHz)
    5
  • Operating Temperature-Max (Cel)
    85
  • Operating Temperature-Min (Cel)
    -40

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XC1718D-DD8I