ProductsManufacturers
Events
Send an RFQBOM Tool

XAM5718AABCXEA

Texas Instruments Incorporated

Texas Instruments Incorporated XAM5718AABCXEA
  • HTS Code
    8542.31.00.30
  • SB Code
    8542.31.00.30
  • Technology
    CMOS
  • Width (mm)
    23
  • Length (mm)
    23
  • JESD-30 Code
    S-PBGA-B760
  • Package Code
    FBGA
  • Package Shape
    SQUARE
  • Package Style
    GRID ARRAY, FINE PITCH Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • J-STD-609 Code
    e1
  • Terminal Finish
    TIN SILVER COPPER
  • Temperature Grade
    INDUSTRIAL
  • Terminal Position
    BOTTOM
  • Number of Terminals
    760
  • Terminal Pitch (mm)
    0.8
  • Package Body Material
    PLASTIC/EPOXY
  • Seated Height-Max (mm)
    2.96
  • Supply Voltage-Max (V)
    1.2
  • Supply Voltage-Min (V)
    1.11
  • Supply Voltage-Nom (V)
    1.15
  • Package Equivalence Code
    BGA760,28X28,32
  • Moisture Sensitivity Level
    3
  • uPs/uCs/Peripheral ICs Type
    SoC
  • Peak Reflow Temperature (Cel)
    250
  • Operating Temperature-Max (Cel)
    105
  • Operating Temperature-Min (Cel)
    -40
  • Time@Peak Reflow Temperature-Max (s)
    30

0 suppliers available to buy or to bid for XAM5718AABCXEA

Send an RFQ

Your RFQ will be directly sent to our expert: Pari

Send an RFQ
XAM5718AABCXEA
Send an RFQ
XAM5718AABCXEA