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XAM437XBZDN

Texas Instruments Incorporated

Texas Instruments Incorporated XAM437XBZDN
  • HTS Code
    8542.31.00.01
  • SB Code
    8542.31.00.25
  • Technology
    CMOS
  • Width (mm)
    17
  • Length (mm)
    17
  • JESD-30 Code
    S-PBGA-B491
  • Package Code
    LFBGA
  • Package Shape
    SQUARE
  • Package Style
    GRID ARRAY, LOW PROFILE, FINE PITCH Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • J-STD-609 Code
    e1
  • Terminal Finish
    TIN SILVER COPPER
  • Terminal Position
    BOTTOM
  • Number of Terminals
    491
  • Terminal Pitch (mm)
    0.65
  • Package Body Material
    PLASTIC/EPOXY
  • Seated Height-Max (mm)
    1.3
  • Supply Voltage-Max (V)
    1.144
  • Supply Voltage-Min (V)
    1.056
  • Supply Voltage-Nom (V)
    1.1
  • Package Equivalence Code
    BGA491,25X25,25
  • Moisture Sensitivity Level
    3
  • uPs/uCs/Peripheral ICs Type
    SoC
  • Peak Reflow Temperature (Cel)
    260
  • Operating Temperature-Max (Cel)
    90
  • Operating Temperature-Min (Cel)
    0
  • Time@Peak Reflow Temperature-Max (s)
    30

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XAM437XBZDN