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XAF04SVOG20Q

Xilinx,Inc.

Xilinx,Inc. XAF04SVOG20Q
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.71
  • SB Code
    8542.32.00.70
  • Type
    NOR TYPE
  • Technology
    CMOS
  • JESD-30 Code
    R-PDSO-G20
  • Package Code
    TSSOP
  • Package Shape
    RECTANGULAR
  • Package Style
    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH Meter
  • Surface Mount
    YES
  • Terminal Form
    GULL WING
  • J-STD-609 Code
    e3
  • Memory IC Type
    CONFIGURATION MEMORY
  • Parallel/Serial
    SERIAL
  • Terminal Finish
    Matte Tin (Sn)
  • DLA Qualification
    Not Qualified
  • Temperature Grade
    AUTOMOTIVE
  • Terminal Position
    DUAL
  • Number of Terminals
    20
  • Terminal Pitch (mm)
    0.635
  • Memory Density (bits)
    4194304
  • Package Body Material
    PLASTIC/EPOXY
  • Standby Current-Max (A)
    0.001
  • Supply Current-Max (mA)
    10
  • Package Equivalence Code
    TSSOP20,.25
  • Clock Frequency-Max (MHz)
    33
  • Moisture Sensitivity Level
    3
  • Peak Reflow Temperature (Cel)
    260
  • Operating Temperature-Max (Cel)
    125
  • Operating Temperature-Min (Cel)
    -40
  • Screening Level / Reference Standard
    AEC-Q100
  • Time@Peak Reflow Temperature-Max (s)
    30

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XAF04SVOG20Q