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XA7Z020-1CLG400Q

Xilinx,Inc.

Xilinx,Inc. XA7Z020-1CLG400Q
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.39.00.01
  • SB Code
    8542.39.00.00
  • Technology
    CMOS
  • Width (mm)
    17
  • Length (mm)
    17
  • JESD-30 Code
    S-PBGA-B400
  • Package Code
    LFBGA
  • Package Shape
    SQUARE
  • Package Style
    GRID ARRAY, LOW PROFILE, FINE PITCH Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • J-STD-609 Code
    e1
  • Terminal Finish
    Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
  • DLA Qualification
    Not Qualified
  • Temperature Grade
    AUTOMOTIVE
  • Terminal Position
    BOTTOM
  • Number of Terminals
    400
  • Terminal Pitch (mm)
    0.8
  • Package Body Material
    PLASTIC/EPOXY
  • Seated Height-Max (mm)
    1.6
  • Package Equivalence Code
    BGA400,20X20,32
  • Moisture Sensitivity Level
    3
  • uPs/uCs/Peripheral ICs Type
    SoC
  • Peak Reflow Temperature (Cel)
    260
  • Operating Temperature-Max (Cel)
    125
  • Operating Temperature-Min (Cel)
    -40
  • Screening Level / Reference Standard
    AEC-Q100
  • Time@Peak Reflow Temperature-Max (s)
    30

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XA7Z020-1CLG400Q
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XA7Z020-1CLG400Q