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XA6SLX25T-2CSG324I

Advanced Micro Devices, Inc. (AMD)

Advanced Micro Devices, Inc. (AMD) XA6SLX25T-2CSG324I
  • HTS Code
    8542.39.00.01
  • SB Code
    8542.31.00.60
  • Width (mm)
    15
  • Length (mm)
    15
  • JESD-30 Code
    S-PBGA-B324
  • Organization
    1879 CLBS
  • Package Code
    FBGA
  • Package Shape
    SQUARE
  • Package Style
    GRID ARRAY, FINE PITCH Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • J-STD-609 Code
    e1
  • Terminal Finish
    TIN SILVER COPPER
  • Number of Inputs
    190
  • DLA Qualification
    Not Qualified
  • Number of Outputs
    190
  • Terminal Position
    BOTTOM
  • Number of Terminals
    324
  • Terminal Pitch (mm)
    0.8
  • Number of Logic Cells
    24051
  • Package Body Material
    PLASTIC/EPOXY
  • Seated Height-Max (mm)
    1.5
  • Supply Voltage-Max (V)
    1.26
  • Supply Voltage-Min (V)
    1.14
  • Supply Voltage-Nom (V)
    1.2
  • Programmable Logic Type
    FIELD PROGRAMMABLE GATE ARRAY
  • Package Equivalence Code
    BGA324,18X18,32
  • Clock Frequency-Max (MHz)
    62.5
  • Moisture Sensitivity Level
    3
  • Peak Reflow Temperature (Cel)
    260
  • Operating Temperature-Max (Cel)
    100
  • Operating Temperature-Min (Cel)
    -40
  • Screening Level / Reference Standard
    AEC-Q100
  • Time@Peak Reflow Temperature-Max (s)
    30
  • Combinatorial Delay of a CLB-Max (ns)
    0.26

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XA6SLX25T-2CSG324I