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XA3S1200E-4FGG400I

Advanced Micro Devices, Inc. (AMD)

Advanced Micro Devices, Inc. (AMD) XA3S1200E-4FGG400I
  • HTS Code
    8542.39.00.01
  • SB Code
    8542.31.00.60
  • Technology
    CMOS, 90 nm
  • Width (mm)
    21
  • Length (mm)
    21
  • JESD-30 Code
    S-PBGA-B400
  • Organization
    2168 CLBS, 1200000 GATES
  • Package Code
    BGA
  • Package Shape
    SQUARE
  • Package Style
    GRID ARRAY Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • J-STD-609 Code
    e1
  • Number of CLBs
    2168
  • Terminal Finish
    Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)
  • Number of Inputs
    304
  • DLA Qualification
    Not Qualified
  • Number of Outputs
    232
  • Temperature Grade
    INDUSTRIAL
  • Terminal Position
    BOTTOM
  • Number of Terminals
    400
  • Terminal Pitch (mm)
    1
  • Number of Logic Cells
    19512
  • Package Body Material
    PLASTIC/EPOXY
  • Seated Height-Max (mm)
    2.43
  • Supply Voltage-Max (V)
    1.26
  • Supply Voltage-Min (V)
    1.14
  • Supply Voltage-Nom (V)
    1.2
  • Programmable Logic Type
    FIELD PROGRAMMABLE GATE ARRAY
  • Package Equivalence Code
    BGA400,20X20,40
  • Clock Frequency-Max (MHz)
    572
  • Moisture Sensitivity Level
    3
  • Number of Equivalent Gates
    1200000
  • Peak Reflow Temperature (Cel)
    250
  • Operating Temperature-Max (Cel)
    85
  • Operating Temperature-Min (Cel)
    -40
  • Screening Level / Reference Standard
    AEC-Q100
  • Time@Peak Reflow Temperature-Max (s)
    30
  • Combinatorial Delay of a CLB-Max (ns)
    4.88

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XA3S1200E-4FGG400I