Texas Instruments Incorporated X66AK2G12ABY100
  • HTS Code
    8542.31.00.01
  • SB Code
    8542.31.00.70
  • Technology
    CMOS
  • Width (mm)
    21
  • Length (mm)
    21
  • JESD-30 Code
    S-PBGA-B625
  • Package Code
    LFBGA
  • Package Shape
    SQUARE
  • Package Style
    GRID ARRAY, LOW PROFILE, FINE PITCH Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • Temperature Grade
    COMMERCIAL
  • Terminal Position
    BOTTOM
  • Number of Terminals
    625
  • Terminal Pitch (mm)
    0.8
  • Package Body Material
    PLASTIC/EPOXY
  • Seated Height-Max (mm)
    1.56
  • Supply Voltage-Max (V)
    1.05
  • Supply Voltage-Min (V)
    0.95
  • Supply Voltage-Nom (V)
    1
  • Package Equivalence Code
    BGA625,25X25,32
  • uPs/uCs/Peripheral ICs Type
    SoC
  • Operating Temperature-Max (Cel)
    70
  • Operating Temperature-Min (Cel)
    0

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X66AK2G12ABY100