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X5323S8Z-4.5A-T1

Intersil Corporation

Intersil Corporation X5323S8Z-4.5A-T1
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.51
  • SB Code
    8542.32.00.50
  • Technology
    CMOS
  • JESD-30 Code
    R-PDSO-G8
  • Memory Width
    8
  • Package Code
    SOP
  • Package Shape
    RECTANGULAR
  • Package Style
    SMALL OUTLINE Meter
  • Surface Mount
    YES
  • Terminal Form
    GULL WING
  • J-STD-609 Code
    e3
  • Memory IC Type
    EEPROM
  • Parallel/Serial
    SERIAL
  • Serial Bus Type
    SPI
  • Terminal Finish
    Matte Tin (Sn) - annealed
  • Write Protection
    HARDWARE/SOFTWARE
  • DLA Qualification
    Not Qualified
  • Temperature Grade
    COMMERCIAL
  • Terminal Position
    DUAL
  • Memory Organization
    4KX8
  • Number of Terminals
    8
  • Terminal Pitch (mm)
    1.27
  • Number of Words Code
    4K
  • Memory Density (bits)
    32768
  • Package Body Material
    PLASTIC/EPOXY
  • Supply Voltage-Nom (V)
    5
  • Data Retention Time-Min
    100
  • Number of Words (words)
    4096
  • Standby Current-Max (A)
    1.0E-6
  • Supply Current-Max (mA)
    5
  • Package Equivalence Code
    SOP8,.25
  • Moisture Sensitivity Level
    1
  • Peak Reflow Temperature (Cel)
    260
  • Endurance (Write/Erase Cycles)
    100000
  • Operating Temperature-Max (Cel)
    70
  • Operating Temperature-Min (Cel)
    0
  • Time@Peak Reflow Temperature-Max (s)
    30

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X5323S8Z-4.5A-T1