ProductsManufacturers
Events
Send an RFQBOM Tool

X25041PG-3

IC MICROSYSTEMS SDN BHD

IC MICROSYSTEMS SDN BHD X25041PG-3
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.51
  • SB Code
    8542.32.00.50
  • Width
    7.62 mm
  • Length
    10.03 mm
  • Technology
    CMOS
  • JESD-30 Code
    R-PDIP-T8
  • Memory Width
    8
  • Organization
    512X8
  • Package Code
    DIP
  • Package Shape
    RECTANGULAR
  • Package Style
    IN-LINE Meter
  • Surface Mount
    NO
  • Terminal Form
    THROUGH-HOLE
  • Memory Density
    4096 bit
  • Memory IC Type
    EEPROM
  • Operating Mode
    SYNCHRONOUS
  • Terminal Pitch
    2.54 mm
  • Number of Words
    512 words
  • Parallel/Serial
    SERIAL
  • Serial Bus Type
    SPI
  • Seated Height-Max
    4.32 mm
  • Temperature Grade
    COMMERCIAL
  • Terminal Position
    DUAL
  • Number of Functions
    1
  • Number of Terminals
    8
  • Number of Words Code
    512
  • Qualification Status
    Not Qualified
  • Package Body Material
    PLASTIC/EPOXY
  • Operating Temperature-Max
    70 Cel
  • Operating Temperature-Min
    0 Cel
  • Supply Voltage-Max (Vsup)
    5.5 V
  • Supply Voltage-Min (Vsup)
    3 V
  • Supply Voltage-Nom (Vsup)
    5 V
  • Clock Frequency-Max (fCLK)
    1 MHz
  • Write Cycle Time-Max (tWC)
    10 ms
  • Peak Reflow Temperature (Cel)
    NOT SPECIFIED
  • Time@Peak Reflow Temperature-Max (s)
    NOT SPECIFIED

0 suppliers available to buy or to bid for X25041PG-3

Send an RFQ

Your RFQ will be directly sent to our expert: Pari

Send an RFQ
X25041PG-3
Send an RFQ
X25041PG-3