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X24C042S8M

IC MICROSYSTEMS SDN BHD

IC MICROSYSTEMS SDN BHD X24C042S8M
  • ECCN
    3A001.a.2.c
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.51
  • SB Code
    8542.32.00.50
  • Technology
    CMOS
  • JESD-30 Code
    R-PDSO-G8
  • Memory Width
    8
  • Package Code
    SOP
  • Package Shape
    RECTANGULAR
  • Package Style
    SMALL OUTLINE Meter
  • Surface Mount
    YES
  • Terminal Form
    GULL WING
  • J-STD-609 Code
    e0
  • Memory IC Type
    EEPROM
  • Parallel/Serial
    SERIAL
  • Serial Bus Type
    I2C
  • Terminal Finish
    Tin/Lead (Sn/Pb)
  • I2C Control Byte
    1010DDMR
  • Write Protection
    SOFTWARE
  • DLA Qualification
    Not Qualified
  • Temperature Grade
    MILITARY
  • Terminal Position
    DUAL
  • Memory Organization
    512X8
  • Number of Terminals
    8
  • Terminal Pitch (mm)
    1.27
  • Number of Words Code
    512
  • Memory Density (bits)
    4096
  • Package Body Material
    PLASTIC/EPOXY
  • Supply Voltage-Nom (V)
    5
  • Data Retention Time-Min
    100
  • Number of Words (words)
    512
  • Standby Current-Max (A)
    0.00015
  • Supply Current-Max (mA)
    3
  • Package Equivalence Code
    SOP8,.25
  • Endurance (Write/Erase Cycles)
    100000
  • Operating Temperature-Max (Cel)
    125
  • Operating Temperature-Min (Cel)
    -55

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X24C042S8M