WAFERSCALE INTEGRATION INC WS5910BYMB
  • ECCN
    3A991.A.2
  • ECCN Governance
    EAR
  • HTS Code
    8542.31.00.01
  • SB Code
    8542.31.00.00
  • Technology
    CMOS
  • JESD-30 Code
    R-GDIP-T40
  • Package Code
    DIP
  • JESD-609 Code
    e0
  • Package Shape
    RECTANGULAR
  • Package Style
    IN-LINE Meter
  • Surface Mount
    NO
  • Terminal Form
    THROUGH-HOLE
  • Terminal Pitch
    2.54 mm
  • Screening Level
    38535Q/M;38534H;883B
  • Terminal Finish
    TIN LEAD
  • Temperature Grade
    MILITARY
  • Terminal Position
    DUAL
  • Supply Current-Max
    70 mA
  • Supply Voltage-Max
    5.5 V
  • Supply Voltage-Min
    4.5 V
  • Supply Voltage-Nom
    5 V
  • Clock Frequency-Max
    29 MHz
  • Number of Terminals
    40
  • Qualification Status
    Not Qualified
  • Package Body Material
    CERAMIC, GLASS-SEALED
  • External Data Bus Width
    12
  • Package Equivalence Code
    DIP40,.6
  • Operating Temperature-Max
    125 Cel
  • Operating Temperature-Min
    -55 Cel
  • uPs/uCs/Peripheral ICs Type
    BIT-SLICE PROCESSOR, MICROPROGRAM SEQUENCER

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WS5910BYMB
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WS5910BYMB