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WS57291C-35TMB

WAFERSCALE INTEGRATION INC

WAFERSCALE INTEGRATION INC WS57291C-35TMB
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.61
  • SB Code
    8542.32.00.60
  • Technology
    CMOS
  • JESD-30 Code
    R-GDIP-T24
  • Memory Width
    8
  • Package Code
    DIP
  • Package Shape
    RECTANGULAR
  • Package Style
    IN-LINE Meter
  • Surface Mount
    NO
  • Terminal Form
    THROUGH-HOLE
  • Memory IC Type
    UVPROM
  • Operating Mode
    ASYNCHRONOUS
  • Parallel/Serial
    PARALLEL
  • DLA Qualification
    Not Qualified
  • Temperature Grade
    MILITARY
  • Terminal Position
    DUAL
  • Memory Organization
    2KX8
  • Number of Functions
    1
  • Number of Terminals
    24
  • Access Time-Max (ns)
    35
  • Number of Words Code
    2K
  • Memory Density (bits)
    16384
  • Package Body Material
    CERAMIC, GLASS-SEALED
  • Number of Words (words)
    2048
  • Operating Temperature-Max (Cel)
    125
  • Operating Temperature-Min (Cel)
    -55
  • Screening Level / Reference Standard
    MIL-STD-883 Class B

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WS57291C-35TMB
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WS57291C-35TMB