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WS128K32-45G2LQ

Microsemi Corporation

Microsemi Corporation WS128K32-45G2LQ
  • ECCN
    3A991.b.2.a
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.41
  • SB Code
    8542.32.00.40
  • Technology
    CMOS
  • Width (mm)
    22.36
  • Length (mm)
    22.36
  • JESD-30 Code
    S-CQFP-G68
  • Memory Width
    32
  • Package Code
    QFP
  • Package Shape
    SQUARE
  • Package Style
    FLATPACK Meter
  • Surface Mount
    YES
  • Terminal Form
    GULL WING
  • J-STD-609 Code
    e4
  • Memory IC Type
    SRAM MODULE
  • Operating Mode
    ASYNCHRONOUS
  • Parallel/Serial
    PARALLEL
  • Terminal Finish
    GOLD
  • DLA Qualification
    Not Qualified
  • Temperature Grade
    MILITARY
  • Terminal Position
    QUAD
  • Additional Feature
    USER CONFIGURABLE AS 512K X 8
  • Memory Organization
    128KX32
  • Number of Functions
    1
  • Number of Terminals
    68
  • Terminal Pitch (mm)
    1.27
  • Access Time-Max (ns)
    45
  • Number of Words Code
    128K
  • Memory Density (bits)
    4194304
  • Package Body Material
    CERAMIC, METAL-SEALED COFIRED
  • Alternate Memory Width
    16
  • Seated Height-Max (mm)
    5.1
  • Supply Voltage-Max (V)
    5.5
  • Supply Voltage-Min (V)
    4.5
  • Supply Voltage-Nom (V)
    5
  • Number of Words (words)
    131072
  • Operating Temperature-Max (Cel)
    125
  • Operating Temperature-Min (Cel)
    -55
  • Screening Level / Reference Standard
    MIL-STD-883

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WS128K32-45G2LQ