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WF8M32-120G4DI5

Microsemi Corporation

Microsemi Corporation WF8M32-120G4DI5
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.51
  • SB Code
    8542.32.00.50
  • Width
    39.6 mm
  • Length
    39.6 mm
  • Technology
    CMOS
  • JESD-30 Code
    S-CQFP-F68
  • Memory Width
    32
  • Organization
    8MX32
  • Package Code
    GQFF
  • Package Shape
    SQUARE
  • Package Style
    FLATPACK, GUARD RING Meter
  • Surface Mount
    YES
  • Terminal Form
    FLAT
  • Memory Density
    268435456 bit
  • Memory IC Type
    FLASH MODULE
  • Operating Mode
    ASYNCHRONOUS
  • Terminal Pitch
    1.27 mm
  • Access Time-Max
    120 ns
  • Number of Words
    8388608 words
  • Parallel/Serial
    PARALLEL
  • Seated Height-Max
    5.2 mm
  • Temperature Grade
    INDUSTRIAL
  • Terminal Position
    QUAD
  • Additional Feature
    ALSO CONFIGURABLE AS 32M X 8
  • Number of Functions
    1
  • Number of Terminals
    68
  • Programming Voltage
    5 V
  • Number of Words Code
    8M
  • Qualification Status
    Not Qualified
  • Package Body Material
    CERAMIC, METAL-SEALED COFIRED
  • Operating Temperature-Max
    85 Cel
  • Operating Temperature-Min
    -40 Cel
  • Supply Voltage-Max (Vsup)
    5.5 V
  • Supply Voltage-Min (Vsup)
    4.5 V
  • Supply Voltage-Nom (Vsup)
    5 V
  • Peak Reflow Temperature (Cel)
    NOT SPECIFIED
  • Time@Peak Reflow Temperature-Max (s)
    NOT SPECIFIED

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WF8M32-120G4DI5