ProductsManufacturers
Events
Send an RFQBOM Tool

WF2M32BI-90HI5A

Microsemi Corporation

Microsemi Corporation WF2M32BI-90HI5A
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.51
  • SB Code
    8542.32.00.50
  • Technology
    CMOS
  • Width (mm)
    30.1
  • Length (mm)
    30.1
  • JESD-30 Code
    S-CPGA-P66
  • Memory Width
    8
  • Package Code
    PGA
  • Package Shape
    SQUARE
  • Package Style
    GRID ARRAY Meter
  • Surface Mount
    NO
  • Terminal Form
    PIN/PEG
  • Memory IC Type
    FLASH MODULE
  • Operating Mode
    ASYNCHRONOUS
  • Parallel/Serial
    PARALLEL
  • DLA Qualification
    Not Qualified
  • Temperature Grade
    INDUSTRIAL
  • Terminal Position
    PERPENDICULAR
  • Additional Feature
    USER CONFIGURABLE AS 4M X 16 OR 2M X 32; 100000 WRITE/ERASE CYCLES MIN
  • Memory Organization
    8MX8
  • Number of Functions
    1
  • Number of Terminals
    66
  • Terminal Pitch (mm)
    2.54
  • Access Time-Max (ns)
    90
  • Number of Words Code
    8M
  • Memory Density (bits)
    67108864
  • Package Body Material
    CERAMIC, METAL-SEALED COFIRED
  • Seated Height-Max (mm)
    6.22
  • Supply Voltage-Max (V)
    5.5
  • Supply Voltage-Min (V)
    4.5
  • Supply Voltage-Nom (V)
    5
  • Number of Words (words)
    8388608
  • Programming Voltage (V)
    5
  • Peak Reflow Temperature (Cel)
    NOT SPECIFIED
  • Operating Temperature-Max (Cel)
    85
  • Operating Temperature-Min (Cel)
    -40
  • Time@Peak Reflow Temperature-Max (s)
    NOT SPECIFIED

0 suppliers available to buy or to bid for WF2M32BI-90HI5A

Send an RFQ

Your RFQ will be directly sent to our expert: Pari

Send an RFQ
WF2M32BI-90HI5A
Send an RFQ
WF2M32BI-90HI5A